The following products and services are part of our product range:
- Electronic module production in SMD (Surface Mounted Device)
- Electronic module production in THT (Through Hole Technology)
- Device assembly and custom technology
- AOI, In-Circuit Test and Programming
- X-ray diagnosis of complex solder joints, entire modules and components
SMD manufacturing
We mount microtechnology in our machine park with four mounting lines:
- Our latest two high-performance lines consist of 2 ASM SX2 modules each, a DEK Horizon 8 paste printer and an Ersa Hotflow 4/20 reflow soldering system.
- A Siplace line consisting of a PCB stacker, a Speedline printer, 5 Siplace modules S15, F3, an inspection bridge and an ERSA Hotflow 11 reflow soldering system.
- Another Siplace line consisting of 3 Siplace modules S 20, F4 and an ERSA Hotflow 11.
THT production
For THT production we have at our disposal an ERSA Versaflow for selective soldering and two Powerflow N2 wave soldering machines of the latest generation.
Our THT production assembles complex mixed circuit boards (SMD and THT) as well as electronic power modules on customer order. Mixed assemblies in THT and SMD technology are soldered RoHS compliant. We offer our customers both soldering processes for the conversion from leaded to lead-free production.
For surface preservation we use the modern painting line Rehm Protecto XP in conjunction with a RDS 3000 oven.
Device assembly and custom technology
For custom technology and individual device assembly, we command an IBL and a REHM vapor phase.
In-circuit test, AOI and programming
In our test field there are two Marconi test systems: an IFR4200 and an IFR4220. The systems offer an in-circuit test as well as function test and programming of all common program blocks.
In addition, the new AOI system OptiCon AdvancedLine from Göpel offers the possibility of a 3D inspection of all assemblies for even better quality.
X-ray diagnosis
With our "pcba|analyzer" X-ray unit from Phoenix, we are also able to carry out an optical inspection even of complex assemblies and hidden solder joints.
